Chip appearance inspection

After the packaging process, integrated circuit (IC) chips must undergo strict testing to ensure product quality. Chip appearance inspection is an essential and important step, which directly affects the quality of IC products and the smooth progress of subsequent production processes. There are three methods for appearance inspection: first, traditional manual inspection methods mainly rely on visual inspection and manual sorting, which have low reliability, low inspection efficiency, high labor intensity, and defects that are not suitable for large-scale production and manufacturing; The second is a detection method based on laser measurement technology, which has high hardware requirements for equipment, corresponding high costs, high equipment failure rate, and difficult maintenance; The third is the detection method based on machine vision. Due to the easy integration and implementation of the detection system hardware, fast detection speed, high detection accuracy, and easy maintenance, this method is becoming increasingly common in the field of chip appearance detection and is a development trend of IC chip appearance detection